Use of Hot air gun
Contents
Background information
Using a heat gun is a key skill for data recovery as it allows for items to be solder/reballed/desoldered with realtive easy compared to using a traditional soldering iron for the same task
What tools you will need
Items are not listed in any particular order
Required
- Hot air gun
- Heat resistance mat
- set of tweezers
Optional but useful
- Digital microscope
Uses of this skill
- 1.BGA reballing
- 2. Chip desoldering
- 3.resoldering of BGA chips
- Reference 1: YouTube video about techniques
- Reference 2: fourm post regarding temperatures
Step-by-step guide with images
Insert step-by-step walkthrough with images and summary text here
Flow chart of order of operations
Insert a flow chart of steps and actions for each task (create using diagram)
Troubleshooting/tips and tricks
Fixes to any common issues that were encountered or could be easily encountered
Q: It keeps blowing away or moving when I bring up the hot air gun!
A: lower you air flow to around 30 litre a minute(3 on a dial) this will stop the component "blowing away". The trick is to "sneak up" on the component by bring the gun in from the side at a 45 degree angle instead of directly on top of the component.
Related Topics
Topics such as desoldering to chip off or firmware dumping for disk PCB repairs
Further reading
External references in wiki references can just be cited through the keyword link