Monolith pin out: Difference between revisions
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Acid(chemical decapsulation) - Soaking the Monolith in Acid just long enough to remove the casing without damaging the internal PCB <a href="https://jcjc-dev.com/2020/10/20/learning-to-decap-ics/">Learning to Decapsulate Integrated Circuits Using Acid Deposition</a> | Acid(chemical decapsulation) - Soaking the Monolith in Acid just long enough to remove the casing without damaging the internal PCB <a href="https://jcjc-dev.com/2020/10/20/learning-to-decap-ics/">Learning to Decapsulate Integrated Circuits Using Acid Deposition</a> | ||
</br> | </br> | ||
Laser(Laser decapsulation - | Laser(Laser decapsulation - Using a high powered layer to burn away the material surounding the die within the monolith</br> | ||
<a href="https://www.youtube.com/watch?v=GTG1iSd_3Vw">IC Laser decapsulation - just experimenting with decapping</a></br> | |||
<a href="https://www.researchgate.net/publication/304626094_Repeatable_Method_for_Automated_Decapsulation_of_Silver_Alloy_Wire_Packages">Repeatable Method for Automated Decapsulation of Silver Alloy Wire Packages</a> | |||
</br> | </br> | ||
CNC(computer numerical controll) - | CNC(computer numerical controll) - Using a preccisly controlled drill bit to slowly remove the external casing.Similar to Laser decapsulation but with a drill bit instead of a laser</br> | ||
</br> | |||
Heat and brute force - For bigger chips a heat source and a pair of pillars to simple remove the casing around the die will often do the job | |||
</br> | </br> | ||
Sanding - the use of absative pads such as carbon fibre abssive pens to remove material</br> | Sanding - the use of absative pads such as carbon fibre abssive pens to remove material</br> | ||
Revision as of 15:23, 28 February 2025
Contents
Background information
This page will cover Monolith pin out, how it functions, how to communicate with a device over it, and where to find the pads.
Monolith storage refers to any storage that is completely built into a singular PCB often inencased in plastic, for example a SD card,
They typically made up of 4 major compotents
- contact pads- The external pads that connects the device to what ever its plugged into
- Controller- Responable for handling the commications between external devices and the internal memory
- Memory- Stores the data
- Passive componets-Such as capacitors,resistors,inductors,ESD and protection Diodes
-
The only way to reasonably access the data on these devices is to solder directly to the pin on the back of the PCB by removing the plastic
and locating the correct pins to access the storage within the device,, while databases of these pinouts exist they typically
require subscriptions to services provided by ACElab or RUsolut, otherwise singular pinouts can be bought from 3rd party vendors or AliExpress
typical Pin out
All NAND devices should follow the ONFI standardand use the same pins, just in different locations on each device.
1. Vcc,
2. GND,
3. CLE,
4. RE,
5. CE,
6. ALE,
7. WP,
8. WE,
9. RB,
10. D0-D7
Steps
In this example, we will be working with a Mirco Secure Digital card(SD)
1. Visual analysis of the Mirco SD card
Is there any visable damage?, Is there any physical cracks?
2. Removal of material to expose pins
Unless there is serious damage to the card and the PCB is exposed,
then material must be removed in order to access the PCB,
This can be done in a few major ways such as,
Acid(chemical decapsulation) - Soaking the Monolith in Acid just long enough to remove the casing without damaging the internal PCB Learning to Decapsulate Integrated Circuits Using Acid Deposition
Laser(Laser decapsulation - Using a high powered layer to burn away the material surounding the die within the monolith
IC Laser decapsulation - just experimenting with decapping
Repeatable Method for Automated Decapsulation of Silver Alloy Wire Packages
CNC(computer numerical controll) - Using a preccisly controlled drill bit to slowly remove the external casing.Similar to Laser decapsulation but with a drill bit instead of a laser
Heat and brute force - For bigger chips a heat source and a pair of pillars to simple remove the casing around the die will often do the job
Sanding - the use of absative pads such as carbon fibre abssive pens to remove material
While standard low grid pieces of sandpaper can be used it is not recomended as it lacks precisison
and makes it more likely to sand through the PCB.
The easiest and cost effective method is Sanding. 3. Identification of each required Pin
The best way to idenify a cards a pinout is to check databases of prexisting pinouts if they include the device your looking for
such as
Rusolut NAND monlith database(requies expensive subcription)
Flash extractor fourm(open but requires login)
Ace lab database(requies expensive subcription)
HDD guru fourm(free and open)
Badcaps fourm(free but requires a account to download schmatic files)
Aliexpress(pinouts can be purchased, often expensive espically if only going to be used once)
Search the internet for the model number and the term pinout(using the "" with make most search certains search for that exact term)
If you are unable to access or find the pinout then, you might have to locate the pins yourself through the following techquies
These can be done with basic but often expensive tools such as a multimeter with counuinity and voltage dection modes, osclioscope and logic analysers
- Ground(GND)- Using the multimeter couninity mode placing one probe on the casing(this is typically grounded), then touch enough pad untill there is a beep
this indcates there is counonity(the two points are connected) you have now found ground - VCC(power) - Typically VCC traces are thicker than others and often on the edge of the PCB
Power up the card(if possible) then using the multimeters voltage mode(typically the 2V setting) then place the black probe on the GND pad you found previously
and touch the red pin to each pad untill the multi meter reads around either 3.3v or 1.8v (due to resistence and the quality of the multimeter it it unlikely to be exect but with 0.1-0.2v is acceptable)
this is likely the VCC pin
If the card will not power up then set the multimeter to reistence mode(Ω)(20k mode)
place the black probe on your GND pin, then using the red probe look for the pin with the lowest resistance (likely within 100Ω-10kΩ) the pin with the lowest resistence is likely VCC. - Data lines(I/0) - Due to the fact that datalines typically link directly to the internal memory they often do not show direct continuity to both GND and VCC
if a pin does not show continuity to either it is likely a data line.
Data lines typically have the resistence of around 1kΩ - 50kΩ unlike VCC which is typically 100Ω - 10kΩ and non connected pads will typically show either extremely high resistence or a open line message(OL)
A oscliloscope or logic analyzer can be used to check if it is likely a data line.
enable power by providing the power pins with either 3.3v or 1.8v depending on what you located,
place probes on each pin and look for A wave/pulsing pattern this means it is likely a dataline. - CLK/CE(clock or chip enable) - follow the same method as for datalines but instead of a wave/pulsing pattern it should be a steady square like pattern.
- Test
- Test
- 1.test
- 2.test
- 3.test
- Reference 1: Monolith pinout search guide
- Reference 2: Open nand flash interface standard
- Reference 3: Robotic-OCT guided inspection and microsurgery of monolithic storage devices
- Reference 4: New Diagnostic Forensic Protocol for Damaged Secure Digital Memory Cards
- Reference 5: Case of study for in situ memory reading on damaged MultiMedia Card
- Reference 6: Monolithic IC
4. Wiring of pins to device(mircosoldering)
Once the pins have been Idenified it is a case of connecting the correct pads to the flash box, either through mircosoldering 5. Data extraction
Depending on the software you are using that should direct you from this point.
What tools you will need
Items are not listed in any particular orderRequired
Optional but useful
Uses of this skill
Step-by-step guide with images
Insert step-by-step walkthrough with images and summary text here
Flow chart of order of operations
Insert a flow chart of steps and actions for each task (create using diagram)
Troubleshooting/tips and tricks
Fixes to any common issues that were encountered or could be easily encountered
Related Topics
Topics such as desoldering to chip off or firmware dumping for disk PCB repairs
Further reading
External references in wiki references can just be cited through the keyword link
- Ground(GND)- Using the multimeter couninity mode placing one probe on the casing(this is typically grounded), then touch enough pad untill there is a beep