BGA reballing

Contents [hide]

• What tools you will need
  • Required
  • Optional but useful
• Uses of this skill
• Step-by-step guide with images
• Flow chart of order of operations
• Troubleshooting/tips and tricks
• Related Topics
• Further reading

Background information

BGA reballing contains the skills of soldering more than it does of electronics reapir.
The process of reballing a ball grid array(BGA) itself is quite straight forward to it being more of a compound of previously learnt skills instead of a completely new skill itself.
The process as a whole can be intimated unless you view it as

1. Just desoldering a chip,
2. Aligning the template over the chips pads pads,
3. Covering the template in a Fine layer of solder(the holes are covered completely)
4. Melting the solder
5. Then putting the chip where it needs to go.

What tools you will need

Items are not listed in any particular order

Required

• Test

Optional but useful

• Test

Uses of this skill

• 1.test
• 2.test
• 3.test

Step-by-step guide with images

Insert step-by-step walkthrough with images and summary text here

Flow chart of order of operations



Troubleshooting/tips and tricks

Fixes to any common issues that were encountered or could be easily encountered

Related Topics

Topics such as desoldering to chip off or firmware dumping for disk PCB repairs

• Related Topic 1
• Related Topic 2

Further reading

External references in wiki references can just be cited through the keyword link

1. Reference 1: Source details
2. Reference 2: Source details