Use of Hot air gun: Difference between revisions

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             <ul>
             <ul>
                 <li>Hot air gun</li>
                 <li>Hot air gun</li>
                 <li> Heat resistence mat </li>  
                 <li> Heat resistance mat </li>  
                 <li> set of tweezers </li>
                 <li> set of tweezers </li>
             </ul>
             </ul>
Line 145: Line 145:
           <h3 id="optional">Optional but useful</h3>
           <h3 id="optional">Optional but useful</h3>
             <ul>
             <ul>
                 <li>Test</li>
                 <li>Digital microscope</li>
             </ul>
             </ul>
         </tr>
         </tr>
Line 153: Line 153:
<h1 id="section1">Uses of this skill</h1>
<h1 id="section1">Uses of this skill</h1>
<ul>
<ul>
<li>1.test</li>
<li>1.BGA reballing</li>
<li>2.test</li>
<li>2. Chip desoldering</li>
<li>3.test</li>
<li>3.resoldering of BGA chips</li>
<h1 id="section2">Step-by-step guide with images</h1>
<h1 id="section2">Step-by-step guide with images</h1>
<p>Insert step-by-step walkthrough with images and summary text here</p>
<p>Insert step-by-step walkthrough with images and summary text here</p>

Revision as of 21:30, 1 December 2024

Data Recovery Resources

Background information

Using a heat gun is a key skill for data recovery as it allows for items to be solder/reballed/desoldered with realtive easy compared to using a traditional soldering iron for the same task

What tools you will need

Items are not listed in any particular order

Required

  • Hot air gun
  • Heat resistance mat
  • set of tweezers

Optional but useful

  • Digital microscope

Uses of this skill

  • 1.BGA reballing
  • 2. Chip desoldering
  • 3.resoldering of BGA chips

    • Step-by-step guide with images

    Insert step-by-step walkthrough with images and summary text here

    Flow chart of order of operations

    Insert a flow chart of steps and actions for each task (create using diagram)

    Troubleshooting/tips and tricks

    Fixes to any common issues that were encountered or could be easily encountered

    Related Topics

    Topics such as desoldering to chip off or firmware dumping for disk PCB repairs

    Further reading

    External references in wiki references can just be cited through the keyword link

    1. Reference 1: Source details
    2. Reference 2: Source details

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