BGA reballing: Difference between revisions
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Revision as of 22:44, 23 February 2025
Contents
Background information
BGA reballing contains the skills of soldering more than it does of electronics reapir.
The process of reballing a ball grid array(BGA) itself is quite straight forward to it being more of a compound of previously learnt skills instead of a completely new skill itself.
The process as a whole can be intimated unless you view it as
- Just desoldering a chip,
- Aligning the template over the chips pads pads,
- Covering the template in a Fine layer of solder(the holes are covered completely)
- Melting the solder
- Then putting the chip where it needs to go.
What tools you will need
Items are not listed in any particular order
Required
- Test
Optional but useful
- Test
Uses of this skill
- 1.test
- 2.test
- 3.test
- Reference 1: Source details
- Reference 2: Source details
Step-by-step guide with images
Insert step-by-step walkthrough with images and summary text here
Flow chart of order of operations
Troubleshooting/tips and tricks
Fixes to any common issues that were encountered or could be easily encountered
Related Topics
Topics such as desoldering to chip off or firmware dumping for disk PCB repairs
Further reading
External references in wiki references can just be cited through the keyword link