Use of Hot air gun: Difference between revisions
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<p> A: lower you air flow to around 30 litre a minute(3 on a dial) this will stop the component "blowing away". | <p> A: lower you air flow to around 30 litre a minute(3 on a dial) this will stop the component "blowing away". | ||
The trick is to "sneak up" on the component by bring the gun in from the side at a 45 degree angle instead of directly on top of the component. | The trick is to "sneak up" on the component by bring the gun in from the side at a 45 degree angle instead of directly on top of the component. | ||
<p> Q: The solder surrounding the thing I want to desolder takes forever to melt</p> | |||
<p> A: The board is likely absorbing the heat from the soldering iron, heating up the board as a whole is recommended to overcome the board's heat dissipation capacity.</br> Heat board to around 100 degrees/37.77c - 150 degrees/65.55c through the use of a board preheater.</br>(Not exact numbers just personal preference, experience as it heats the board enough without causing heat damage to other areas or melting other solder.) </p> | |||
<h1 id="section5">Related Topics</h1> | <h1 id="section5">Related Topics</h1> | ||
<p>Topics such as desoldering to chip off or firmware dumping for disk PCB repairs</p> | <p>Topics such as desoldering to chip off or firmware dumping for disk PCB repairs</p> | ||
Revision as of 18:16, 19 December 2024
Contents
Background information
Using a heat gun is a key skill for data recovery as it allows for items to be solder/reballed/desoldered with realtive easy compared to using a traditional soldering iron for the same task
What tools you will need
Items are not listed in any particular order
Required
- Hot air gun
- Heat resistance mat
- set of tweezers
Optional but useful
- Digital microscope
Uses of this skill
- 1.BGA reballing
- 2. Chip desoldering
- 3.resoldering of BGA chips
- Reference 1: YouTube video about techniques
- Reference 2: fourm post regarding temperatures
Step-by-step guide with images
Insert step-by-step walkthrough with images and summary text here
Flow chart of order of operations
Insert a flow chart of steps and actions for each task (create using diagram)
Troubleshooting/tips and tricks
Fixes to any common issues that were encountered or could be easily encountered
Q: It keeps blowing away or moving when I bring up the hot air gun!
A: lower you air flow to around 30 litre a minute(3 on a dial) this will stop the component "blowing away". The trick is to "sneak up" on the component by bring the gun in from the side at a 45 degree angle instead of directly on top of the component.
Q: The solder surrounding the thing I want to desolder takes forever to melt
A: The board is likely absorbing the heat from the soldering iron, heating up the board as a whole is recommended to overcome the board's heat dissipation capacity.
Heat board to around 100 degrees/37.77c - 150 degrees/65.55c through the use of a board preheater.
(Not exact numbers just personal preference, experience as it heats the board enough without causing heat damage to other areas or melting other solder.)
Related Topics
Topics such as desoldering to chip off or firmware dumping for disk PCB repairs
Further reading
External references in wiki references can just be cited through the keyword link