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    <h1>What tools you will need</h1>
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        <h2>Uses of this skill</h2>
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     <ul>
         <li><a href="#">Related Topic 1</a></li>
     
         <li><a href="#">Related Topic 2</a></li>
     
        <li><a href="#section2"> Step-by-step guide with images</a></li>
         <li><a href="#section3"> Flow chart of order of operations</a></li>
        <li><a href="#section4"> Troubleshooting/tips and tricks</a></li>
        <li><a href="#section5"> Related Topics</a></li>
         <li><a href="#section6"> Further reading</a></li>
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<h1> Background information </h1>
<p> This page will cover Chip off, how it functions, how to communicate with a device over it, and where to find the correct chips themselves.
<br> Chip off refers to the process of taking a chip (usual NAND module or device controller) off a PCB, typically with soldering flux and a hot air gun </br>
then either resoldering to another PCB (typically in the case of controllers (see HDD controller swap page) or placing in a reader for data extraction purposes </br>
typically after the chip has been either cleaned (how to clean a chip page) or reballed (link to reballing page) </p>
<h1 id="section2">Step-by-step guide with images</h1>
<p>Insert step-by-step walkthrough with images and summary text here</p>
<p> Dissemble device (refer to safe dissembly of devices page)
</br> identify the chip </br>
clear area of any metal shielding or parts that could get in the way of removal
</br>
surround the components with heat-resistant tape such as kapton tape </br>
to limit any heat related damage to these components
</br> apply a thin line of flux around the outer perimeter of the chip
</br>
set hot air gun to around xxx degrees/centigrade and air flow of xxxx LPM (dials typically range from 10 to 100 LPM) 
</br>
bring up hot air gun directly above the chip as close as safely possible (link using a hot airgun page)
</br> In order to check if the solder joints have melted gently poke the chip with something to see if it moves(e.g. tweezers, xacto knife, chip lifter)
</br> lift chip up and on to heatproof surface gently.
<br>
Inspect the chip for any leftover solder or damage, in the case of BGA the ball pins on the underside of the chip, and SMB chips the chips surrounding the chip
</br>
for how to reball a chip, please refer to the appropriate page (link to reballing page)
</p>
<h1 id="section3">Flow chart of order of operations</h1>
<p>Insert a flow chart of steps and actions for each task (create using diagram)</p>
<h1 id="section4">Troubleshooting/tips and tricks</h1>
<p>Fixes to any common issues that were encountered or could be easily encountered</p>


     <h2 id="section5">7. Further reading</h2>
<h1 id="section5">Related Topics</h1>
    <div class="reference-list">
<p>Topics such as desoldering to chip off or firmware dumping for disk PCB repairs</p>
        <ol>
<ul>
            <li>Reference 1: <a href="#">Source details</a></li>
    <li><a href="#">Related Topic 1</a></li>
            <li>Reference 2: <a href="#">Source details</a></li>
     <li><a href="#">Related Topic 2</a></li>
        </ol>
</ul>
    </div>
 
<h1 id="section6">Further reading</h1>
<p>External references in wiki references can just be cited through the keyword link</p>
<div class="reference-list">
    <ol>
        <li>Reference 1: <a href="#">Source details</a></li>
        <li>Reference 2: <a href="#">Source details</a></li>
    </ol>
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Latest revision as of 13:24, 10 March 2025

Data Recovery Resources

Background information

This page will cover Chip off, how it functions, how to communicate with a device over it, and where to find the correct chips themselves.
Chip off refers to the process of taking a chip (usual NAND module or device controller) off a PCB, typically with soldering flux and a hot air gun
then either resoldering to another PCB (typically in the case of controllers (see HDD controller swap page) or placing in a reader for data extraction purposes
typically after the chip has been either cleaned (how to clean a chip page) or reballed (link to reballing page)

Step-by-step guide with images

Insert step-by-step walkthrough with images and summary text here

Dissemble device (refer to safe dissembly of devices page)
identify the chip
clear area of any metal shielding or parts that could get in the way of removal
surround the components with heat-resistant tape such as kapton tape
to limit any heat related damage to these components
apply a thin line of flux around the outer perimeter of the chip
set hot air gun to around xxx degrees/centigrade and air flow of xxxx LPM (dials typically range from 10 to 100 LPM)
bring up hot air gun directly above the chip as close as safely possible (link using a hot airgun page)
In order to check if the solder joints have melted gently poke the chip with something to see if it moves(e.g. tweezers, xacto knife, chip lifter)
lift chip up and on to heatproof surface gently.
Inspect the chip for any leftover solder or damage, in the case of BGA the ball pins on the underside of the chip, and SMB chips the chips surrounding the chip
for how to reball a chip, please refer to the appropriate page (link to reballing page)

Flow chart of order of operations

Insert a flow chart of steps and actions for each task (create using diagram)

Troubleshooting/tips and tricks

Fixes to any common issues that were encountered or could be easily encountered

Related Topics

Topics such as desoldering to chip off or firmware dumping for disk PCB repairs

Further reading

External references in wiki references can just be cited through the keyword link

  1. Reference 1: Source details
  2. Reference 2: Source details

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