BGA reballing
Contents
Background information
BGA reballing contains the skills of soldering more than it does of electronics reapir.
The process of reballing a ball grid array(BGA) itself is quite straight forward to it being more of a compound of previously learnt skills instead of a completely new skill itself.
The process as a whole can be intimated unless you view it as
- Just desoldering a chip,
- Aligning the template over the chips pads pads,
- Covering the template in a Fine layer of solder(the holes are covered completely)
- Melting the solder
- Then putting the chip where it needs to go.
What tools you will need
Items are not listed in any particular order
Required
- Test
Optional but useful
- Test
Uses of this skill
- 1.test
- 2.test
- 3.test
- Reference 1: Source details
- Reference 2: Source details
Step-by-step guide with images
Insert step-by-step walkthrough with images and summary text here
Step one, Enabling the fume extractor to ensure any hazardous fumes are removed (if you are able to smell the fumes then your extractor is not working correctly).
Step two, Set the tempreture of your soldering iron to 200C/395F for lead-free 183C/361F for leaded solder (these are not exect numbers you may have to adjust according to your needs and tools).
Step three, Completely cover the tip of the iron with fine layer of solder to "tin" it(this will help with heat transfer and protect the tip).
Step Four, Place the item in the vice in the postion you want so that you can clean it.
Step Five, Clean up the area with desoldering wick or lint free cotton buds and 99% isopropyl alcohol.(this just ensures the area is clean) a long flat tip is recommended as it provides covers more surface area
which makes the process faster as you spend less time covering area.
Step Six, This is a before(left) and after(right) after desoldering and cleaning(not a perfect example)
Step Seven, This is the template for the solder to form into the correct locations/balls to fall into
Step Eight , Line up the template holes with the pads on the chip then attach it with kapton tape(Note it is important this is easy to remove)
Step Nine , Insert into vice/heat proof holder
Step Ten Apply a small blob of solder paste (like in the image) then taking a flat plastic object pushing the solder
across the template until all the holes are covered as shown. Personally I prefer plastic glue scrabers as they are cheap and just the right size, but a credit card would also work.
Step Eleven Attach the smallest attachment to the hot air gun such as the one shown
Step twelve , Set the temperature of your Hot air gun to 250C/482F for lead-free 200C/352F for leaded solder and around 40 litres per minute(4 on a dial) (these are not exact numbers you may have to adjust according to your needs and tools).
Step thirteen Hold the hot air gun 2-3" 5.08-7.62cm away from the chip moving the hot air gun in the shape of a sideways 8 until the solder melts.
Step fourteen(do this otherwise you will make a mess and have to clean and redo, you aren't going to save 30 seconds,Remove the heat and wait for the solder to solidify, then remove the tape/what ever was holding the
template onto the chip.(slice it with a sharp thin blade works best I find.
Step fourteenLift the template and chip(they should be stuck together) 1" 2.54cm off the work surface with a pair of tweezers then gentally heat in the same side ways 8 figure untill the chip drops off.
Flow chart of order of operations
Troubleshooting/tips and tricks
Fixes to any common issues that were encountered or could be easily encountered
Related Topics
Topics such as desoldering to chip off or firmware dumping for disk PCB repairs
Further reading
External references in wiki references can just be cited through the keyword link